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Editorial Board
Editor-in-Chief
- Douglas O'Shaughnessy Université du Québec, Canada
Associate Editors
- Prof Jont B Allen University of Illinois, United States of America
- Xavier Anguera Telefonica R&D, Spain
- Dr Roland Badeau Telecom ParisTech, France
- Gérard Bailly GIPSA-Lab, France
- Douglas S Brungart Wright Air Force Base, United States of America
- Tom Bäckström Friedrich Alexander University Erlangen-Nürnberg, Germany
- Wai-Yip Geoffrey Chan Queen University, Canada
- Dan Chazan IBM, Israel
- Mark Clements Georgia Institute of Technology, United States of America
- Christophe D'Alessandro CNRS, France
- Roger Dannenberg Carnegie Mellon University, United States of America
- Nicholas Evans EURECOM, France
- Tim Fingscheidt Technische Universität Braunschweig, Germany
- Horacio Franco SRI International Research Institute, United States of America
- Qian-Jie Fu House Ear Institute, United States of America
- W S Gan Nanyang Technological University, Singapore
- Panayiotis G. Georgiou USC Viterbi School of Engineering, United States of America
- Philippe Gournay University of Sherbrooke, Canada
- Phil Green University of Sheffield, United Kingdom
- Richard Heusdens Delft University of Technology, The Netherlands
- Reinhold Häb-Umbach University of Paderborn, Germany
- Kate Knill Cambridge University, United Kingdom
- Prof Yves Laprie LORIA, France
- Dominic W Massaro University of California, United States of America
- Ben Milner University of East Anglia, United Kingdom
- Climent Nadeu Technical University of Catalonia, Spain
- Elmar Nöth Universität Erlangen-Nürnberg, Germany
- Hiroshi G Okuno Kyoto University, Japan
- Nitendra Rajput IBM Research, India
- Prof Gerhard Rigoll Technical University of Munich, Germany
- Hiroshi Saruwatari Nara Institute of Science and Technology, Japan
- T V Sreenivas Indian Institute of Science, India
- Yannis Stylianou Foundation for Research and Technology - Hellas (FORTH), Greece
- Tomoki Toda Nara Institute of Science and Technology, Japan
- Toon van Waterschoot Katholieke Universiteit Leuven, Belgium
- S Voran Institute for Telecommunication Sciences, United States of America
- DeLiang Wang Ohio State University, United States of America
